| 摘要 |
PURPOSE: A method and an apparatus for detecting defect on the basis of characteristics are provided which improves the throughput and the performance. CONSTITUTION: An apparatus is for detecting a defect in a patterned substrate like a wafer. The method for detecting a defect comprises the steps of: preparing a reference image and a test image; extracting the characteristics from the reference image and from the test image; matching the characteristics of the reference image with the characteristics of the test image; and checking a defect by comparing the characteristics of the reference image with that of the test image. The method further includes the step of aligning the test image with the reference image before matching the characteristics of the images, and the step of recording the confirmed defect when comparing the characteristics of the reference image and the test image. The images can be electron-beam voltage-contrast images.
|
