| 摘要 |
<p>An enclosure for image forming devices manufactured by a method including a bonding step at which the bonding is conducted at a temperature lower than 400 °C being the lowest temperature necessary at a frit-bonding step, having merits such that the luminescence hardly lowers, the life is long, the display quality is high, and the gettering effect is sufficient. The bonding part between a rear plate (2) and an outer frame (3) and between the face plate (4) and the outer frame (3) is bonded with an adhesive (9) and a sealant (14). The sealant is selected from among metals including In, Al, Cu, Au, Ag, Pt, Ti, and Ni, their alloys, and organic or inorganic adhesives containing a coated metal or alloy selected from the metals and their alloys. The adhesive (9) is selected from among organic adhesives including polyphenyl compounds, polybenzimidazole resins, and polyimide resins, and inorganic adhesives including aluminum, silica, zirconia, and carbon.</p> |
