| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-size package having a reduced mounting area and also reduce electric resistance and thermal resistance of backside electrodes in a semiconductor chip. SOLUTION: An insulating substrate 21 has an island section 22 and electrode sections 23a, 23b on its surface and a semiconductor chip 25 is fixed to the surface of the island section 22. An electrode pad 26 of the semiconductor chip 25 is connected to the electrode sections 23a, 23b by wires 27. On a rear surface of the insulating substrate 21, first and second external connection terminals 29, 29a, 29b are formed, with the first terminals 29 connected to the island section 22 by a first via hole 30 and the second terminals 29a, 29b connected to the electrode sections 23a, 23b by second via holes 31a, 31b. The first via hole 30 is located just under the semiconductor chip 25. The connection distance can be minimized to reduce electric resistance and thermal resistance. |
