发明名称 COOLING ARRANGEMENT AND ELECTRONIC EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To locally cool the heat producing portion of a heat producing device or the like to enhance efficiency in cooling and thus save power by forming hollows on the heat producing face of the heat producing device and jetting cooling fluid against the hollows. SOLUTION: Crater-like hollows 2 are formed on the heat producing device 1 mounted on a mounting board and cooling fluid is jetted out of a jet stream generating means 3 against the hollows 2 to cool the heat producing device 1. Jetting ports 5 constituted of nozzles or vents, opposed to the hollows 2 on the heat producing device 1, are formed on the cooling fluid jet stream generating means 3. When the jet stream generating means 3 is driven to jet cooling fluid such as air out of the jetting ports 5, the jets become jet stream which are made to impinge on the hollows 2 on the heat producing device 1 and the points at which the jets impinge on the hollows 2 are stagnation points (a). The jets are also made to impinge on the areas around the hollows 2 and the cooling fluid flows toward the surface along the peripheral areas to accomplish cooling.</p>
申请公布号 JP2000252670(A) 申请公布日期 2000.09.14
申请号 JP19990051620 申请日期 1999.02.26
申请人 SONY CORP 发明人 YAZAWA KAZUAKI
分类号 G06F1/20;F25D1/00;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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