发明名称 |
METHOD FOR MANUFACTURING CATHODE IN PLASMA ETCHING DEVICE AND CATHODE THEREBY |
摘要 |
PURPOSE: A method for manufacturing a cathode in a plasma etching device and a cathode thereby are provided to remove the remaining projections of a hole by using a potassium hydroxide. CONSTITUTION: A method for manufacturing a cathode in a plasma etching device and a cathode thereby comprise the steps of a hole forming process, a physical surface polishing process, and a chemical surface polishing process. The hole forming process enable a plurality of hole on a substrate in order to perform an inflow process of a gas to an etching chamber. The physical surface polishing process is to polish a surface of a silicon substrate by using a slurry. The chemical surface polishing process is to remove the remaining projections from an inner face and an outer face of the hole by using a potassium hydroxide.
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申请公布号 |
KR100265289(B1) |
申请公布日期 |
2000.09.15 |
申请号 |
KR19980002382 |
申请日期 |
1998.01.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JIN SEONG;LEE, YEONG GU;SHIM, GYEONG MAN;CHOI, GYU SANG |
分类号 |
H05H1/46;H01J9/14;H01J17/04;H01J37/32;H01L21/302;H01L21/306;H01L21/3065;(IPC1-7):H01J17/04 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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