| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce connection failures of electrode bond zones due to dust, etc., and lessen cracks at the electrode bond zones, even when the number of repair times of bare chips increases in the flip-chip mounting. SOLUTION: This semiconductor device comprises a mounting board 1 with electrodes 2 formed on a main surface, a bare chip 11 mounted in the flip-chip structure on the main surface of the board, and a resin layer formed between the board and the bare chip 11. The flip-chip structure is such that a fixing plate 4 with electrodes is formed on the surface of the resin layer between the board and the bare chip, and bumps 14 of the bare chip are bonded to the electrodes of the board via the electrodes of the fixing plate.</p> |
