| 摘要 |
PROBLEM TO BE SOLVED: To provide a supercompact light emitting device, in which a symmetrical light intensity distribution can be obtained in the longitudinal direction of a substrate, and reliability of wire bonding can be increased. SOLUTION: A notched part 7 is formed at one end of a substrate 2, and two notched parts 8a and 8b are formed at both side edges on the other end of the substrate 2. First and second electrode patterns 3 and 4, covering the notched parts on the both ends, are formed on the surface of the substrate, and a light emitting diode(LED) chip 1 is connected with a first electrode pattern 3, and an electrode 1a of an LED chip 1 is connected with a surface side electrode 4a of the second electrode pattern 4 by wire bonding. Then, the LED chip 1 and a metallic wire 5 are sealed with transmitting resin mold 6. The wire bonding is carried out by the surface side electrode 4a of the second electrode pattern 4 and a terminal 5a of the metallic wire on the substrate which is left between the two notched parts.
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