| 摘要 |
PROBLEM TO BE SOLVED: To obtain a chip type light emitting diode array which has wide directivity and a high-output characteristic and, in addition, can be reduced in size and thickness. SOLUTION: A flat metallic plate 21 and a plurality of lead terminals 22 are integrally formed with a resin enclosure 10, in such a state that the plate 21 and the inner sections of the terminals 22 are exposed on the top face of the enclosure 10. A metallic substrate 30 on which a plurality of light reflecting recesses 40 is formed is joined to the top face of the plate 21, and light emitting diode elements 50 are respectively mounted on the bottom faces of the recesses 40. In addition, the diode elements 50 are respectively connected to the inner sections of the terminals 22 and an optical lens 71 is attached to the front faces of the recesses 40. |
