发明名称 SUBSTRATE PROCESSING APPARATUS AND AIR FEED METHOD
摘要 PROBLEM TO BE SOLVED: To provide a new substrate processing apparatus which is more energy-saving and space-saving than the conventional apparatus and is capable of controlling its temperature and humidity. SOLUTION: An application development device 1 is equipped with a resist applicator 30 with a cup CP, and an air feeder 81 feeds air of prescribed temperature and humidity into the cup CP, where the air feeder 81 is equipped with a cooling dehumidifying section 86, a bypass circuit 87, a heating section 88, humidifying section 89, and a blower 90, 55% of introduced air is cooled down and dehumidified in the cooling/dehumidifying section 86, 45% of the introduced air is made to pass through the bypass circuit 89, a mixed air of cooled and dehumidified air and air that passes through the bypass circuit 87 is heated in the heating section 88 and humidified in the humidifying section 89.
申请公布号 JP2000299280(A) 申请公布日期 2000.10.24
申请号 JP20000006309 申请日期 2000.01.12
申请人 TOKYO ELECTRON LTD 发明人 SENBA NORIO
分类号 B05D3/04;B05C9/08;G03F7/16;G03F7/30;H01L21/027 主分类号 B05D3/04
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