| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent concentration of stresses in a film resistor provided on a board. SOLUTION: Masks 20 are formed on the part, corresponding to connection edge parts 14a on a conductor pattern 12 of an alumina laminated substrate 11 with the conductor pattern 12 on the surface in this manufacturing method as shown in Figure (b). Then, a first plating process is conducted, and an intermediate copper plated layer 21 is formed on the region excluding the part covered by the masks 20 as shown in (c). Then, the masks 20 are removed in (d), copper is plated on the surface of the intermediate copper plated layer 21 by performing a second plating process, copper is plated in a thin film form on the part, corresponding to a connection edge part 14a on the surface of the conductor pattern 12, and a copper plated electrode 14 is formed in (e). Subsequently, a thick-film resistor 15 is formed on the surface of the alumina laminated substrate 11 in (f). Since the connection edge part 14a is thinner than the other parts, a nearly flat thick-film resistor 15 can be formed.</p> |
