发明名称 ELECTRONIC PARTS PACKAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an electronic parts packaging device capable of executing various packaging work at the time of packaging electronic parts and provided with constitution for easy operation and easy maintenance. SOLUTION: The electronic parts packaging device is provided with four electronic parts fitting machines 12A to 12D, a packaging substrate carrying means and a communication system 16 for executing communication between fitting machines 12. Each fitting machine 12 is provided with a communication part 18 for inputting/outputting data to/from the system 16, a selection filter 20 for selecting and acquiring sequence data concerned with the logical number of a set machine out of inputted sequence data and an operation control part 22 for controlling electronic parts fitting operation based on the acquired sequence data. The fitting machine 12A acting as a master machine executes a systematic control function for the whole device and the fitting machines 12A to 12D act as slave machines. The fitting machine 12A acting as the master machine is provided with a data base 24 for storing plural sequence data and a sequence compiler 26 including a connection control soft program for controlling the fitting machines 12A to 12D acting as the slave machines.
申请公布号 JP2000322108(A) 申请公布日期 2000.11.24
申请号 JP19990129353 申请日期 1999.05.11
申请人 SONY CORP 发明人 MORITA SUNAO
分类号 G05B19/05;G05B19/02;H05K13/04;H05K13/08 主分类号 G05B19/05
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