| 摘要 |
PROBLEM TO BE SOLVED: To provide a backlight structure with of uniform high-luminance plane light emission, allowing miniaturization and thinning of an apparatus using the backlight. SOLUTION: This backlight structure has a semiconductor light emitting device 2 electrically connected to a conductive material such as a wiring board, and a transmissive light guide plate 1 taking in light from a light emitting element 2a of the semiconductor light emitting device 2 and planarly emitting light toward the rear face of a liquid crystal display panel 3 or the like. The semiconductor light emitting device 2 is installed near the center of an opposite face to a light emission face of the light guide plate 1, while a light dispersing means nearly uniformly equalizing light from the light emitting element 2a on the whole face of the light guide plate 1 is provided between the light emitting element 2a and the light emission face of the light guide plate 1. |
