发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To obtain a method and device for mounting electronic components for continuing to simultaneously suck a plurality of electronic components by a plurality of suction nozzles mounted to a fitting head. SOLUTION: A plurality of component supply parts 1 and 2 are provided, the arrangement interval of a suction nozzle 4 is matched to that of electronic component at the component supplys 1 and 2, thus setting a combination for simultaneously sucking and retaining the electronic components by the plurality of suction nozzles 4 to each of the part supplys 1 and 2. Then, when one or more part cutting is generated in the electronic components for simultaneously sucking and retaining the plurality of suction nozzles 4 in one part supply 1, control is made to move a fitting head 6 to the other part supply 2 and for simultaneously sucking and retaining the electronic components by the plurality of suction nozzles 4.
申请公布号 JP2001015998(A) 申请公布日期 2001.01.19
申请号 JP20000127114 申请日期 2000.04.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIMURA NAOTO;OGATA HIROSHI;KONISHI CHIKA;OBARA HIROSHI
分类号 H05K13/04 主分类号 H05K13/04
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