发明名称 |
POLISHING METHOD AND POLISHING DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device to provide high flatness of even a glass panel dimensioned such that a ratio of a size in an diagonal direction to the effective width of a platen is 80% or more. SOLUTION: In this device, a plurality of abrasive feed holes 1c are situated in a dispersing state in a peripheral direction in the surface 1a, making contact with a glass panel, of an upper platen 1 and the positions of the abrasive feed holes 1c adjoining each other in a peripheral direction and a position in a radial direction are situated different from each other. This polishing method is such that the glass panel is nipped between the upper and lower platens to rotate a carrier held in a fit-in state in a holding hole, and the surface of the glass panel is polished by revolving in a rotating state the carrier as abrasive is fed in a gap between the upper platen 1 and the lower platen through a plurality of the abrasive feed holes 1c formed in the upper platen 1.</p> |
申请公布号 |
JP2001030159(A) |
申请公布日期 |
2001.02.06 |
申请号 |
JP19990208984 |
申请日期 |
1999.07.23 |
申请人 |
NIPPON ELECTRIC GLASS CO LTD |
发明人 |
TERANISHI YASUO;KANO TOMONORI |
分类号 |
B24B37/00;(IPC1-7):B24B37/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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