SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a position recognizing mark, without enlarging the chip area or limiting the flexibility in layout. SOLUTION: In this device, bonding pads 10 and wiring 12 are formed on the surface of a semiconductor chip 74. A protection film 16 is formed on the periphery 101 of the bonding pad 10 and wiring 12 on the surface of the semiconductor chip 74. A position recognizing mark 18 for the position of the bonding pad 10 is opened in the protection film 16 on the wiring 12.