| 摘要 |
PROBLEM TO BE SOLVED: To constantly maintain the gap between a chip and a substrate by tracking the behavior of a mark in a mounting process with an image sensor, measuring the abrupt thermal displacement, feeding it back to the up/down control of the tool, and canceling the thermal displacement. SOLUTION: A tool head 3 is rapidly heated by a heating means, a bump is melted, and connection is made. A mark 15 is provided on the side surface at the tip part of the tool head 3, and the position of the mark 15 is measured by an image sensor 20. In the measurement, the position of the mark 15 from a heating start point is tracked, the displacement is fed back to a control means, a drive system is operated, and two stages 2 are controlled so that the position of the mark 15 to be measured by the image sensor 20 returns to a fixed point, and the thermal displacement is cancelled, thus constantly maintaining the gap between a chip 5 and a substrate 4.
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