CONDUCTIVE PARTICLE AND MANUFACTURE THEREOF, CONDUCTIVE ADHESIVE, MOUNTING BODY OF SEMICONDUCTOR DEVICE, MOUNTING BODY OF SEMICONDUCTOR PACKAGE AND MOUNTING BODY OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide conductive particles satisfactory in corrosion resistance and oxidation resistance and superior in migration resistance, in addition to superior conductivity, and its manufacturing method, conductive adhesive made by using the conductive particles, a mounting body of a semiconductor device constituted by using the conductive adhesive, a mounting body of a semiconductor package and a mounting body of electronic components which are chip and capacitor. SOLUTION: In this conductive particle 1, a second conductive material 3 high in ionization tendency is partially disposed on a surface of a first conductive material 2 low in ionization tendency. In the conductive particle 1 at this time, a surface of the second conductive material 3 high in ionization tendency is completely coated with a coating layer made of the first conductive material 2 low in ionization tendency. In the coating layer, an opening part 4 for partially exposing the second conductive material 3 is formed.