| 摘要 |
PURPOSE:To sustain the high airtightness on a junction surface by a method wherein a case body is halved and then hollow elastic member sealed with a gas are arranged on the junction parts to sustain the airtightness within the automatic soldering device wherein a substrate with electronic parts is heated while being carried to be soldered in a heating chamber filled up with an inert gas. CONSTITUTION:Multiple case bodies 11 vertically halved is to be a box body wherein heating chamber 15 to be an inert gas chamber filled up with nitrogen gas for soldering step is held by hollow members 14 in the same shape as that of the junction part between the junction parts 11a and 11b so as to sustain the airtightness. At this time, the nitrogen gas at the pressure of 0.2-1kg/cm<2> is sealed in this case body. When a substrate 19 and electronic part 30 are preliminarily heated, carried to a reflow soldering chamber to be brought into contact with the nitrogen gas heated at about 250 deg.C, a creamy solder is fused to solder the electronic parts 30 onto the substrate 19. At this time, within the heating chamber 15 filled up with the nitrogen gas in low oxygen concentration, the fused solder and lead wire of the electronic parts 30 are not to be oxidized at all.
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