| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a package for accommodating electronic components for normally operating the electronic components without adhesion of brazing materials to the inner electronic components. SOLUTION: This package for accommodating electronic components consists of an insulation substrate 1 having a mounting part 1a, where electronic components 3 are mounted on the upper surface and an annular metallization layer 5 for sealing deposited so that the mounting part 1a is surrounded, and a metal lid body 2 that is jointed to the entire surface of a lower surface by seam welding or electron beam welding via a brazing material 6. The surface of the brazing material 6 deposited on the lower surface of the metal lid body 2, is covered with a metal film 7 having a melt point higher than that of the brazing material 6. The electronic parts 3 being accommodated inside can be operated normally, without spattering of the brazing material 6 to the inside of the package.</p> |
