| 摘要 |
<p>PROBLEM TO BE SOLVED: To appropriately maintain the quantity of flow of resin and protect the chip surface and inner leads in semiconductor manufacturing equipment for applying a liquid resin to semiconductor packages. SOLUTION: Parts 3a and 3b of a lead of a package are coated with a liquid resin 6a having a smaller filler particle size than the gap between the leads by a dispenser 5a. After the coating operation, a semiconductor chip 1 is coated with a liquid resin 6b having larger filler particle size than the gap between the leads by a dispenser 5b. Since the liquid resin 6a exhibits a lower viscosity and a higher flowability than the liquid resin 6b, desired resin is flowed out to the rear side of an insulating film 2 passing through a device hole 4 and a desired thickness of coating can be performed on the semiconductor chip 1.</p> |
