发明名称 LED ARRAY CHIP AND MANUFACTURING METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide an LED array chip, the light-emitting sections of which do not make large light quantity fluctuate, even when the sections are arranged at a high density by reducing the shape variations of the contact sections of individual electrodes respectively connected to diffusion regions. SOLUTION: In an LED array chip provided with individual electrodes 5 respectively connected to a plurality of diffusion areas 4, each individual electrode 5 is composed of a contact section 5a, formed on the corresponding diffusion area so as to cover part of the diffusion region for ohmic contact, a bonding pad section 5c for wire bonding connection, and a wiring section 5b connecting the contact section 5a to the pad section 5c and the thickness of the electrode film of the contact section 5a is made thinner than those of the electrode films of the pad section 5c and a wiring section 5b.</p>
申请公布号 JP2001102635(A) 申请公布日期 2001.04.13
申请号 JP19990277865 申请日期 1999.09.30
申请人 OKI ELECTRIC IND CO LTD 发明人 SHIMIZU TAKAATSU;OGIWARA MITSUHIKO;YANAKA MASUMI
分类号 H01L33/08;H01L33/36;H01L33/38;H01L33/44;H01L33/62 主分类号 H01L33/08
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