| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an organic substrate printed wiring board with excellent heat-resistant properties, electrical insulation properties, heat expansion coefficients, etc. SOLUTION: A printed wiring board comprises at least one composition layer consisting of a substrate made from polybenzazol fiber cloth, and at least one composition layer consisting of substrate made from glass fiber cloth. With this constitution, the printed wiring board which has excellent heat- resistant properties, heat expansion coefficients, excellent solder heat resistant properties, migration-resistant properties, etc., after moisture absorption and high reliability of holes, can be manufactured.</p> |
