| 摘要 |
In a bare-chip LSI mounting board test apparatus, at the stage that a bare-chip LSI is mounted on a board, tester boards on which equivalent parts corresponding to SMT parts other than the bare-chip LSI to be mounted on the board is confronted to the board, probes connected to the respective equivalent parts of the tester boards which correspond to the mount parts ar e brought into contact with pads located at the mount places of the mount part s on the board on which the bare-chip LSI is mounted to built a quasi-mount state of the mount parts to the board, and under this state a test signal is transmitted from a controller to the bare-chip LSI. |
