| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting chips, by which the efficiency of chip mounting can be improved by reducing the range of motion of a transfer head for transferring chips placed on trays and mounting them on a substrate. SOLUTION: Chips are picked up by a transfer head 30 from trays 16, placed above a transfer path for transferring substrates 11 by guide rails 13 and are mounted on prescribed coordinates of a substrate 11 positioned in a positioning part connected to the transfer path. In this way, tact time can be reduced by reducing the range of motion of the transfer head 30, and chip-mounting efficiency can be improved. |
