| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor module capable of having an excellent heat radiating property over a long period of time, by evading the problem of lowering of pressing force caused by deformation. SOLUTION: A semiconductor module 18 is provided with an annular metal frame 13 which has a bottom surface touching the upper surface of an external radiating board 11 as a fitting surface, and has a flange 20 linked to the peripheral brim of an insulating board 17 from the first main surface side of a ceramic board along its own peripheral brim. The metal frame 13 is fixed to the external board 11 with screws 12, or glued to the external board 11 with an adhesive agent. The metal frame 13 fixed with screws or glued to the external board 11 presses the peripheral brim of the insulating board 17, in the direction of the external board 11 by the flange 20. The insulating board 17 is pressure- welded to the external board 11 by this pressing force. |
