METHOD OF FORMING PATTERNED THIN-FILM LAYER

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a patterned thin-film layer by a lift-off technology with which productivity and yield are improved, and in general, mass production cost is reduced. SOLUTION: A method of forming a patterned thin-film layer by forming a mask layer for lifting off a specified pattern on an electrically insulating films substrate, forming a thin-film layer of a specified pattern extending both on the substrate and the mask layer, and peeling off the mask layer from the interface with the substrate to remove the mask layer and the thin-film layer positioned on the mask layer (lift-off layer 10), thus forming a thin-film layer of a desired pattern. The lift-off layer 10 is, for example, scanned with a suctioning head 20 of a vacuum suction machine 21 having a suctioning head to suck and peel off the lift-off layer 10.