首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
A metal mold device for molding a substrate
摘要
申请公布号
IN186039(B)
申请公布日期
2001.06.09
申请号
IN1992DE90319
申请日期
1992.10.09
申请人
SONY CORPORATION
发明人
KUDO JUNICHIRO;SHIMIZU JUN
分类号
B29C45/26;(IPC1-7):B29C45/26
主分类号
B29C45/26
代理机构
代理人
主权项
地址
您可能感兴趣的专利
FOLDING BLINDS FOR WINDOWS AND DOORS
Temperature measuring device
Multi-well culture dish assembly
Collection container assembly
Collection container assembly
Electromagnetic-wave shielding and light transmitting plate
Improved power supply system for a packet-switched radio transmitter
HERBICIDAL COMPOSITION
The stabilisation of soluble sulphates in substratum materials
Method and device for treating an impure liquid
Electrolytic solution for capacitor and capacitor
Wear Assembly
Rear view mirror for vehicles
Electromagnetic relay, joining structure for hinge spring and yoke in the electromagnetic relay
Communication control method and apparatus, and communication system
Semiconductor light emitting device and method for manufacturing the same
客车、轿车空调(暖风)通风管中的湿度微调辅助装置
自动安平水准仪
一种可旋转双绳提引冲击钻头
Discharge lamp igniting apparatus
