| 摘要 |
PROBLEM TO BE SOLVED: To offer a semiconductor manufacturing apparatus which enables uniform sticking of a resin tape on which a wiring pattern for connecting internal terminals with external terminals is formed, to a semiconductor chip such as LSI and IC. SOLUTION: A bumping member, comprising a predetetmined depth of grooves 6 having a gratings shape is arranged on a stage 5. A resin tape on which a wiring pattern is formed and a semiconductor chip 3 are placed on the bumping member. When the substrate is pressed by a pressing member 4, only the bumping member under the semiconductor chip is pressed so as to fill the grooves, thereby pressing the resin tape uniformly. |
