| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method for semiconductor devices which makes adhesion between a conductor circuit board and a semiconductor chip excellent, has high labor effectiveness, and enhances their reliability. SOLUTION: This method is provided with a process of forming an elastomer insulating adhesive layer 50 having first openings 51 through which electrode pads 22 are exposed, on the surface of a semiconductor device integrated circuit pattern 21 of a semiconductor chip 20 fitted with a plurality of electrode pads 22, and a process of forming a conductor circuit pattern 70 on an insulating layer 60 having second openings 61 corresponding to the first openings 51, and forming a conductor circuit board 40 having connecting terminals 71 penetrating the second openings 61 and projecting toward the semiconductor-chip-mounted- surface side of the insulating layer 60 from the circuit pattern 70. Along with forming an electrical conducting circuit by connecting the connecting terminals 71 to the electrode pads 22 corresponding to the connecting terminals 71, the circuit board 40 and the semiconductor chip 20 are joined through the adhesion layer 50.</p> |
