| 摘要 |
PURPOSE: To accelerate removing speed by reducing damages on a surface to be polished, in a method for finish polishing a silica substrate. CONSTITUTION: A method for finish polishing a silica substrate comprises a step of providing the substrate, a step of first polishing the surface of the substrate to a range of surface roughness Ra to 6 to 10Åby using an aqueous solution containing at least one type of metal oxide abrasive, and a step of further grinding the surface of the substrate to the roughness Ra to about 5Åor less, by using the aqueous solution containing a colloidal silica soot having a mean particle size of 50 to 500 nm. |
