| 摘要 |
PURPOSE: An electronics module and a method of manufacturing the same is provided to achieve a cooled power electronics module of reduced bulk. CONSTITUTION: An electronics module comprises a metal substrate having a major face that has an insulating layer(12) thereon and that carries a plurality of electrical connection tracks(16) and a non-insulated major face, and at least one power component(18) fixed on the non-insulated major face of the substrate and having connection tabs(20) which pass through the substrate via holes(30) therein and are electrically insulated from the substrate, the tabs being soldered to respective ones of the tracks, and a housing(22) bonded to an inside wall of a cooling fluid circuit, and the component being located inside the housing and in close contact therewith. |
