发明名称 METHOD AND DEVICE FOR CONTROLLING SURFACE MOUNTING
摘要 PROBLEM TO BE SOLVED: To prevent an impact to an electronic part and to shorten the cycle times of a sucking operation and a mounting operation as much as possible. SOLUTION: This control device lowers a sucking head, by which the electronic part is sucked, at a maximum speed by a first speed control unit. When the control device receives the output of a position detection sensor for detecting that the sucking head arrives at a position directly before a substrate, it switches the control of the sucking head to an touching control by a second speed control unit to change a lowering speed to a minimum speed to lower the sucking head at very slow speeds until the sucking head touches the substrate. When the occurrence of a setting touching pressure is detected by the pressure of a load cell, the device performs a pressing control of pressing the sucking head on the substrate to a target pressure as follows: the lowering speed is once increased to a setting middle speed and then is gradually lowered according to a change in the pressure difference between the target pressure and the detected pressing pressure.
申请公布号 JP2001210995(A) 申请公布日期 2001.08.03
申请号 JP20000013480 申请日期 2000.01.21
申请人 YAMAHA MOTOR CO LTD 发明人 YAMADA TAKESHI
分类号 H05K13/04 主分类号 H05K13/04
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