| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a lead frame and a resin sealed device in which residual resin is removed without causing any cracking in the resin remaining on a runner by the impact of a punch. SOLUTION: A lead frame 12 is provided with cut holes 19 and an upper die 1 is provided with recesses 3 facing the cut holes 19, at the time of resin sealing, so that no protrusion, projecting from the cut hole 19 of the lead frame 12 and adhering to the lead frame 12 after resin sealing, is formed on the resin mass of a runner 16.</p> |
