发明名称 PROCESS FOR PREPARING PRESSURE-SENSITIVE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a process for preparing a solvent-free type, pressure- sensitive adhesive composition which process is a polymerization by an ultraviolet ray irradiation, at a fast rate of the polymerization, with little vaporization of a monomer when polymerizing and with little limitation on the monomer constitution and gives a polymer having a high molecular weight. SOLUTION: The process for preparing a pressure-sensitive adhesive composition is characterized by using, as the chief ingredient of the pressure-sensitive adhesive composition, an acrylic polymer that is formed by carrying out a polymerization while irradiating an ultraviolet ray having a substantially single wave length onto a composition consisting of a monomer of the main component of an alkyl (meth)acrylate and a photo-free radical generator and that has a glass transition temperature of 250 K or lower.
申请公布号 JP2001220564(A) 申请公布日期 2001.08.14
申请号 JP20000035641 申请日期 2000.02.08
申请人 NITTO DENKO CORP 发明人 MOROISHI YUTAKA;SUGIMOTO MASAKAZU;INOUE YASUSHI;YAMAMOTO MICHIHARU
分类号 C09J133/06;(IPC1-7):C09J133/06 主分类号 C09J133/06
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