发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, plating bath contaminating property, developability and mechanical strength. SOLUTION: In the photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator, a compound of formula I (where each of four symbols R is a 1-6C alkyl and each of four symbols Z is a halogen atom) is contained as an essential component as the component C. |
申请公布号 |
JP2001222104(A) |
申请公布日期 |
2001.08.17 |
申请号 |
JP20000035646 |
申请日期 |
2000.02.08 |
申请人 |
HITACHI CHEM CO LTD;HODOGAYA CHEM CO LTD |
发明人 |
HIDAKA TAKAHIRO;NATORI MICHIKO;MURAKAMI TAIJI |
分类号 |
G03F7/029;G03F7/027;G03F7/032;G03F7/033;H05K3/06;H05K3/18 |
主分类号 |
G03F7/029 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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