| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device, by which product yield can be improved by preventing the damage of a semiconductor wafer. SOLUTION: In the manufacturing method of the semiconductor device by which conductive sections 7 are formed to electrodes 2 for the external connection of a semiconductor element, the reverse side of the circuit forming surface of the semiconductor wafer 1 under the state, in which a protective film 3 is formed onto the circuit forming surface, is removed and the circuit forming surface is thinned. Through-holes 3a penetrated to the protective film 3 are formed in response to the positions of the electrodes 2 in the protective film 3, and the conductive films 7 electrically conducted with the electrodes 2 are formed into the through-holes 3a and the protective film 3 is removed from the semiconductor wafer 1. Thus, the semiconductor wafer 1 in the case of the formation of the conductive sections is reinforced, and the damage of the semiconductor element can be prevented.
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