APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING GAS JET DEVICE

摘要

PURPOSE: An apparatus for manufacturing semiconductor device is provided to prevent transmission of heat within the gas jet device by including a cooling section within a jet plate at the bottom of a sealing section and a heat insulated section within the cooling section. CONSTITUTION: The apparatus includes a reaction chamber(43) onto which a semiconductor wafer is loaded. A gas injection device has a plurality of through holes(47) for uniformly spraying a source gas on the reaction chamber. A gas injection section has a given space through which the source gas is injected into the gas injection device. The gas injection device includes upper and lower spray plates(49,51), that are located on the reaction chamber, one or more sealing sections(61,65) that face the spray plate and the chamber or the gas injection section and the spray plate at both sides of the spray plate, and a cooling section(63) located within the spray plate. A first gas injection line(55) is installed between the upper spray plate(51) and the lower spray plate(49).