发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a positive type etching resist composition excellent in operation stability and having high sensitivity and good conductor image forming property. SOLUTION: The positive type photosensitive resin composition contains a photosensitive acrylic resin (A) having a photosensitive group of formula 1 (where X is a group of formula 2 or 3; R1 is alkyl, cycloalkyl or alkyl ether; and R2 is alkylene containing a 1-12C linear, branched or cyclic hydrocarbon) at a concentration of 0.1-1.0 mol per 1 kg resin and having a number average molecular weight of 6,000-100,000 and a water-soluble or water-dispersible acrylic resin composition (B) having a salt forming group.
申请公布号 JP2001242619(A) 申请公布日期 2001.09.07
申请号 JP20000052737 申请日期 2000.02.29
申请人 KANSAI PAINT CO LTD 发明人 MIYAGAWA KENJI;HONMA HIROYUKI;SEKO KENJI
分类号 G03F7/023;G03F7/033;G03F7/039;G03F7/09;G03F7/40;G03F7/42 主分类号 G03F7/023
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