| 摘要 |
<p>PURPOSE:To release heat generated at a board and to prevent deterioration of a light emitting element, a photodetector on a photoelectric integrated circuit by interposing a discharging plate between boards in a three-dimensional photoelectric integrated circuit device in which boards are stacked and signals are transmitted to each other among the boards by using a light. CONSTITUTION:A heat sink plate HS is interposed between a pair of photoelectric integrated circuit boards 0Ea, 0Eb. A signal optical passage is provided between a light emitting element array 14 of the board OEa and a photodetector array 15 of the board 0Eb. A signal light passage hole 10 is formed at the plate HS in the passage, and signal light is passed through the hole 10 to transmit the signal between the two boards OEa and 0Eb. Since the heat sink plate is interposed between the integrated boards, heat generated from the board is dissipated through the plate, the high temperature of the board is prevented, and a large-scale three-dimensional integration can be realized.</p> |
