发明名称 FLATTENING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a flattening device capable of smoothly receiving a ground wafer in a cassette without breaking it. SOLUTION: According to this flattening device 10, a chamfering stage 23 is mounted on the flattening device 10 mounted with a rough grinding stage 18, a precise grinding stage 20 and a polishing stage 22 of the wafer 28, and a sharp edge part 28A of the polished wafer 28 is chamfered by the chamfering stage 23, and thereafter the wafer 28 is housed in the cassette 26. Thereby, the wafer 28 is smoothly housed in the cassette 26 without being caught thereby.</p>
申请公布号 JP2001252853(A) 申请公布日期 2001.09.18
申请号 JP20000066842 申请日期 2000.03.10
申请人 TOKYO SEIMITSU CO LTD 发明人 ISHIKAWA TOSHIHIKO
分类号 B23Q7/04;B24B7/00;B24B9/00;B24B37/00;H01L21/304;(IPC1-7):B24B7/00 主分类号 B23Q7/04
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