摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flattening device capable of smoothly receiving a ground wafer in a cassette without breaking it. SOLUTION: According to this flattening device 10, a chamfering stage 23 is mounted on the flattening device 10 mounted with a rough grinding stage 18, a precise grinding stage 20 and a polishing stage 22 of the wafer 28, and a sharp edge part 28A of the polished wafer 28 is chamfered by the chamfering stage 23, and thereafter the wafer 28 is housed in the cassette 26. Thereby, the wafer 28 is smoothly housed in the cassette 26 without being caught thereby.</p> |