发明名称 |
High frequency component and communication apparatus incorporating the same |
摘要 |
A high frequency component minimizes changes in the inductance of a chip coil mounted on a substrate such that stable characteristics are obtained. In the high frequency component, chip components including the chip coil are mounted on the substrate. A hole is provided in a portion of a metal cover positioned above the chip coil when the metal cover covers the top portion of the substrate.
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申请公布号 |
US2001026953(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20010795519 |
申请日期 |
2001.02.28 |
申请人 |
ITO TOMONORI;YOSHIDA NORIO;WATANABE TAKAHIRO |
发明人 |
ITO TOMONORI;YOSHIDA NORIO;WATANABE TAKAHIRO |
分类号 |
H01F27/36;H01F27/02;H01P1/00;H05K9/00;(IPC1-7):H01L21/44 |
主分类号 |
H01F27/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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