ADHESIVE COMPOSITION, FLAME RETARDANT ADHESIVE COMPOSITION, ADHESIVE FILM, PRINTED CIRCUIT BOARD FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To prepare an adhesive film applicable under a low pasting load and free from bleeding through a through-hole without deteriorating the low elastic modulus, high heat-resistance and high moisture resistance necessary for the mounting of a semiconductor chip on a circuit board having large difference of thermal expansion coefficient from the chip and called as an interposer such as glass-epoxy resin substrate or flexible substrate, and to provide a semiconductor-mounting circuit board provided with the adhesive film and a semiconductor device. SOLUTION: The adhesive film, the semiconductor-mounting circuit board and the semiconductor device are manufactured by using an adhesive composition containing 100 pts.wt. of an epoxy resin and its hardener, 10-100 pts.wt. of a polymer component containing functional group and having a weight- average molecular weight of >=100,000 and Tg of >=-40 deg.C and <=0 deg.C and 0.1-20 pts.wt. of a cure accelerator.