ARTICLE COMPRISING CREEP-RESISTANT AND STRESS-REDUCING SOLDER

摘要

The invention relates to use of a solder composition exhibiting a desired combination of high creep resistance at typical operating temperatures and low stress in formed solder joints. The invention uses a solder containing 82 to 85 wt.% Au, 12 to 14 wt.% Sn, and 3 to 4 wt.% Ga (optionally with up to 2 wt.% additional elements). The small amount of added Ga induces a significant depression in the liquidus temperatures of both Au and Sn, and thus a depressed melting point (about 27.degree.C less than eutectic Au-Sn solder), and also provides an enhanced temperature-sensitivity of the solder's creep resistance.