发明名称 Method and System for Forming Patterns Using Charged Particle Beam Lithography with Variable Pattern Dosage
摘要 A method and system for fracturing or mask data preparation or optical proximity correction or proximity effect correction or mask process correction is disclosed in which a set of shaped beam shots is determined that is capable of forming a pattern on a surface, where the set of shots provides different dosages to different parts of the pattern, and where the dose margin from the set of shots is calculated. A method for forming patterns on a surface is also disclosed.
申请公布号 US2016299422(A1) 申请公布日期 2016.10.13
申请号 US201615184099 申请日期 2016.06.16
申请人 D2S, Inc. 发明人 Fujimura Akira;Zable Harold Robert
分类号 G03F1/78;G03F7/20;G03F1/70 主分类号 G03F1/78
代理机构 代理人
主权项 1. A method for fracturing or mask data preparation or proximity effect correction or optical proximity correction or mask process correction comprising the step of determining a plurality of shaped beam charged particle beam shots for an exposure pass, wherein the plurality of shaped beam shots is capable of forming a pattern on a surface, wherein the plurality of shaped beam shots provides different dosages to different parts of the pattern, and wherein the step of determining comprises calculating a dose margin from the plurality of shaped beam shots.
地址 San Jose CA US