| 发明名称 |
METHOD OF LASER BEAM MACHINING, METHOD OF MANUFACTURING WORK WITH LASER BEAM, AND METHOD OF CLEANING |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To machine by removing material of a specified layer by making it irradiated with a laser beam and to remove a material deposited on the inside of a peephole of a tightly closed vessel, which is directly inaccessible. SOLUTION: A member 10 is irradiated with an ultrashort pulse laser beam (as shown by arrow A). The ultrashort pulse laser beam is a femtosecond laser beam and its intensity P satisfies the relation P1<P<P2, where P1 stands for the threshold value of an ablation machining for a first material and P2 stands for the threshold value of an ablation machining for a second material. A composite material is irradiated with the laser beam by adjusting incident power P of the femtosecond laser beam to satisfy the relation P1<P<P2, then only a part of the first material 11 irradiated with the laser beam is removed due to an ablation. It is also possible to remove only the first material 11 by making it irradiated with the laser beam from the side of the second material 12 when the second material 12 is transparent to the incident beam.</p> |
| 申请公布号 |
JP2001300749(A) |
申请公布日期 |
2001.10.30 |
| 申请号 |
JP20000115720 |
申请日期 |
2000.04.17 |
| 申请人 |
FUJI XEROX CO LTD |
发明人 |
IWASA IZUMI;SATO YASUSATO;FURUKI MAKOTO;FU RYUJUN;ONISHI AKIO |
| 分类号 |
B08B7/02;B23K26/00;H05K3/00;(IPC1-7):B23K26/00 |
主分类号 |
B08B7/02 |
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