| 摘要 |
PROBLEM TO BE SOLVED: To (1) provide a cross-linking group-containing polyamic acid that is a precursor of a cross-linking group-containing polyimide and has excellent storage stability, to (2) provide a cross-linked polyimide obtained by thermally treating the cross-linking group-containing polyimide that has excellent heat resistance and excellent soldering heat resistance, and to (3) provide a heat- resistant adhesive that contains (2) the cross-linked polyimide. SOLUTION: This cross-linking group-containing polyimide precursor characterized by having the cross-linking groups at 5 to 99 mol.% of the molecular terminals of repeating units represented by general formula (1) [K is a direct bond or a divalent bond of CO, SO2, S, O, CH2, C(CH3)2 or C(CF3)2; L1 to L4, L'1 to L'4 and L"1 to L"4 are each H, F, Cl, Br, I, CN, OCH3, trifluoromethyl, methyl, ethyl, phenyl, 4-phenylphenyl, phenoxy, or 4-phenylphenoxy; Ar1 is a tetravalent group of formula (V); X is a divalent group of formula (VI)]. |
