摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a short electronic part with small surface area is mounted after a tall electronic part is mounted, a sucking nozzle collides with the tall electronic part so that the tall electric part falls, and mounting becomes imperfect in mounting electronic parts at high density on a circuit board using an electronic part mounting device. SOLUTION: The information about height of electronic parts is used as a reference to mount the electronic parts on a circuit board in the order of height, with the shortest one mounted first, and after mounting of the shortest electronic part is confirmed, the next shortest electronic part is started to be mounted. |