发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To solve the problem that, when a short electronic part with small surface area is mounted after a tall electronic part is mounted, a sucking nozzle collides with the tall electronic part so that the tall electric part falls, and mounting becomes imperfect in mounting electronic parts at high density on a circuit board using an electronic part mounting device. SOLUTION: The information about height of electronic parts is used as a reference to mount the electronic parts on a circuit board in the order of height, with the shortest one mounted first, and after mounting of the shortest electronic part is confirmed, the next shortest electronic part is started to be mounted.
申请公布号 JP2001332900(A) 申请公布日期 2001.11.30
申请号 JP20000153630 申请日期 2000.05.24
申请人 MURATA MFG CO LTD 发明人 ITO YUICHI;YAMADA MASAHIRO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
代理机构 代理人
主权项
地址