| 摘要 |
PROBLEM TO BE SOLVED: To provide a wavelength conversion material for converting the wavelength of light from the main light take-out face of a flip-chip light emitting element into white light, a semiconductor light emitting device, and its manufacturing method. SOLUTION: A flip-chip light emitting element 1 is provided on a sub-mount element 2 while conducting and covered, on the periphery thereof, with a wavelength conversion paste material containing a material for converting the wavelength of light from the light emitting element 1 using the sub-mount element as a saucer. One or both of the upper surface of the transparent substrate 1a of the light emitting element 1 and the contour face of the wavelength conversion material layer 16 is made parallel with the rear surface electrode forming face of the sub-mount element, and the wavelength conversion material layer is uniform on the main light take-out face. Consequently, light from the main light take-out face of the light emitting element is subjected to uniform wavelength conversion resulting in emission with uniform chromaticity. |
