| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high light quantity or high emission efficiency edge emission chip type light emitting element in which light emitted from a light emitting chip is taken out sideways effectively. SOLUTION: An LED chip 4 is connected with an insulating substrate 1 on which a pair of inner electrodes 2A, 2B are formed while straddling the inner electrodes 2A, 2B. The LED chip 4 has an emission face 4a perpendicular to the insulating substrate 1 and directing toward the irradiation side face A of an edge emission chip type light emitting element 10. The LED chip 4 is connected with the inner electrodes 2A, 2B, respectively, at a lower part of a p-type electrode formed of a hardened silver paste 5 on the emission face 4a and at a lower part of a short side electrode formed on a face opposite to the emission face. |
