发明名称 METHOD FOR DETECTING DEFECT OF ELECTRONIC COMPONENT MODULE
摘要 PROBLEM TO BE SOLVED: To securely detect a defect of an electronic component module used for a portable telephone, a GPS receiver, etc., at its final inspection stage (electric inspection). SOLUTION: A multiple-piece printed board is composed of six board pieces having specific circuit patterns formed and it is decided through outward appearance inspection whether each board piece is good to select a defective board piece (S1). A drill hole is bored in this defective board piece to cut part of the circuit pattern (S2) and necessary electronic components are mounted on the respective board pieces to constitute electronic component modules, respectively (S4). Then it is decided through electric inspection whether each electronic component module is good (S6). Consequently, the defective board piece decided as defective through the outward appearance inspection has its defectiveness made distinctive by the cutting of the circuit pattern even if it is nearly good. Consequently, an electronic component module having an electronic component mounted on the defective board piece can precisely be detected through the electric inspection and removed without any mistake.
申请公布号 JP2001358432(A) 申请公布日期 2001.12.26
申请号 JP20000176820 申请日期 2000.06.13
申请人 IWAKI ELECTRONICS CORP 发明人 ABE MASAHISA;SASAKI TAKASHI;KONUMA TAKAYUKI
分类号 G01R31/28;G01R31/00;H05K3/00;H05K3/22;H05K13/08 主分类号 G01R31/28
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